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Publishdate:2025-11-27 Views:32

Electronic Design and Simulation Tools

 

Ansys HFSS: A three-dimensional structural high frequency electromagnetic field simulation tool

Ansys HFSS is the industry benchmark and gold tool for high frequency structural EMF simulation tools, truly solving EMFs of arbitrary three-dimensional structures with a wide range of adaptability; its applications stretch from DC through to optical wave bands. With a simple and easy-to-use graphical user interface, the software automatically generates meshes and conducts adaptive mesh refinement, supporting broadband adaptive mesh profiling. Highly accurate, reliable and stable EMF solving is realized with the high-performance EMF solver. Since it's fully oriented to engineering problems, you can quickly achieve highly accurate simulation results without having to acquire intensive knowledge of EMF and repeatedly try different mesh profiling. The software supports a variety of electromagnetic field solvers, including frequency domain finite element solver, time domain finite element solver, eigenmode solver, characteristic mode solver, integral equation method, physical optics method, multilayer planar structure moment method, domain decomposition method, finite large array antenna solver; it supports multi-algorithm hybrid calculations and is capable of solving all kinds of high-frequency and radiation problems in an all-around and reliable manner. It enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: High-frequency devices; antennas; cables; integrated circuit packaging; connectors; PCBs; antenna layout; electromagnetic compatibility

 

 

Ansys Maxwell: A two-dimensional/three-dimensional dynamic electromagnetic field simulation tool

Ansys Maxwell is extensively used for the design of a wide range of electromagnetic components, including motors, electromagnetic sensors, actuators, magnetic heads, transformers, inductors and more. The electromagnetic field simulation enables the calculation of electric and magnetic field distributions. The visualization of dynamic field distribution is used to analyze the performance of devices and to yield parameters such as force, torque and inductance that match the measurement results.

The automatic mesh profiling and adaptive mesh profiling allows the use of advanced finite element methods to yield highly accurate simulation results without having to repeatedly define the meshes themselves. This can greatly reduce the difficulty of using the software and improve engineering practicality, thus minimizing product development costs and shortening design cycles. It automatically generates ROM models, enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: Various motors (rotary motors, and linear motors); electromagnetic coils; transformers; magnetic recording; magnetization; demagnetization; actuators; electromagnetic sensors; frictionless bearings; other electromagnetic components

 

 

Ansys Q3D Extractor: A three-dimensional structural parasitic parameter extraction tool

Ansys Q3D Extractor performs electromagnetic field calculations, extracts parasitic parameters (resistance R, inductance L, capacitance C, and conductance G), and generates SPICE/IBIS equivalent circuit models based on the structure of electronic component. With the increasing speed and integration of electronics, the effects such as reflections, transmission delays, crosstalk and synchronous switching noise (SSN) in systems are increasingly significant. The electromagnetic parasitic effects of complex structures such as packages, connectors, and cables in systems must be accurately simulated to ensure the operational performance of system. Ansys Q3D Extractor uses the boundary element method to quickly solve for electromagnetic parasitic parameters based on structural form and material properties. Two-way coupled simulation with Ansys Structure/Fluid is possible.

Application areas: Integrated circuit packaging; connectors; sockets; PCBs; touch screens; fingerprint readers; contactless smart cards

 

Ansys SIwave: A full SI/PI and EMI/EMC simulation design tool for PBC and BGA packaging

Ansys SIwave offers full signal integrity and power integrity simulation design for PCBs, BAG packaging, etc. With modern electronic devices developing in the direction of low voltage and low power consumption, noise tolerances for printed circuit boards and packages have been narrowing; in memory circuits, for example, synchronous switching noise is often the main cause of system defects; therefore, the power supply system must be optimally designed to ensure system specifications and proper circuit operation.

With the latest optimization algorithms, Ansys SIwave efficiently performs holistic simulations of complex, large circuit boards. This comprises signal line parameter extraction, power/ground plane parameter extraction, DC voltage drop simulation, crosstalk simulation, far-field and near-field radiation simulations, electromagnetic sensitivity simulation, embedded capacitor, and inductor device model libraries. It enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: Printed circuit boards; BGA packaging

 

 

Ansys Savant: Antenna layout analysis software for electric large platforms

Savant is a high-frequency progressive electromagnetic analysis software. It uses the bouncing ray (SBR) progressive algorithm and a hybrid computational technique with the HFSS full wave solver to support CPU and GPU acceleration. This enables fast and accurate prediction of the performance of loaded antennas mounted on platforms of tens to thousands of wavelengths in size, yielding results such as mutual coupling effects between multiple antennas, spatial near/far field distribution, radiated and scattered fields.

Application areas: Antenna layout and integration; electronic warfare; communication links; co-location jamming; vehicle mounted radar; vehicle interconnection; EMI/EMC, etc.

 

Ansys Icepak: A thermal design simulation tool for electronics

Ansys Icepak is a professional thermal design simulation tool for electronics. It employs the fluid simulation tool Ansys Fluent as its solver and comprises a rich set of physical models. The unique automatic unstructured mesh generation technology helps electronics engineers to achieve easy, accurate and fast engineering of thermal design and simulation.

The software supports a wide range of CAD and EDA data and enables simulation models to be built, meshes to be generated, solved and post-processed and simulation results to be studied in an integrated environment. It can be used for a wide range of applications from the full range of thermal simulation and design of various semiconductor devices such as BGAs, QFPs, LEDs and IGBTs to circuit boards and enclosures.

The software exports thermal simulation results to the multidimensional multi-domain electromechanical system circuit and system simulation design tool Ansys Twin Builder, which simulates the operating characteristics of the system at different temperatures: It reads Joule heat from DC simulations from the board and package SI/PI/EMI simulation tool Ansys SIwave as a distributed heat source for full board and system thermal simulations.

 

Thermal Fluid Analysis of Graphic Board

 

Circuit and System Simulation Software

Ansys RF Option (Designer RF): An integrated simulation environment for high-frequency circuits/systems and electromagnetic fields

Ansys RF Option is an integrated simulation environment for high frequency circuits and systems. It supports the design of all types of wired and wireless communication systems and circuit simulations; provides powerful system simulation capabilities, a harmonic balance analog non-linear frequency domain circuit simulator, and a momentum multilayer planar structure electromagnetic field simulation tool; enables system simulation design, DC analysis, linear network analysis, cross-modulation and non-linear distortion simulation, circuit modulation envelope simulation, oscillator simulation, phase noise simulation, time-varying noise simulation, layout simulation and patch antenna design; supports a wide range of non-linear device models and LTCC, MMIC and RFIC process models; performs automatic bidirectional dynamic linking and on-demand solving with HFSS, a 3D EMF tool, for efficient and accurate design.

 

 

Ansys SI Option (Designer SI): An integrated simulation environment for high-speed circuits/systems and electromagnetic fields

Ansys SI Option seamlessly integrates the circuit/system time-frequency domain simulation techniques and EMF model extraction required for high-speed design into an automated design environment, taking full account of the impact of PCBs, cables and more. The unique "solving on demand" technique allows solvers to be selected depending on need. This environment supports SPICE models, IBIS models and IBIS-AMI models, S-parameter models, etc. It provides a variety of simulation techniques including frequency and time domain system simulators, linear circuit simulators, linear and non-linear transient circuit simulators, momentum method multi-layer planar structure electromagnetic field simulators, etc. for the simulation and analysis of high-speed circuits and EMI problems.

 

Ansys Twin Builder——System Simulator 

Ansys Twin Builder is an integrated system simulation tool that converts Ansys CAE 3D simulation models for EMF/structural/fluid/thermal analysis into 0D components and provides a high-accuracy and high-speed system simulation environment. In addition to using Ansys CFD, Modelica and VHDL-AMS, SPICE and MATLAB/Simulink coupling analysis as computational models, it's also possible to use the functional safety embedded software development tool Ansys SCADE as a controller model and perform system verification.

 

 

Ansys EMIT: System-level electromagnetic interference analysis software

EMIT is the simulation software for predicting electromagnetic interference (EMI) in complex radio frequency (RF) environments. EMIT offers a holistic framework for RF system performance data management, co-location and co-existence EMI effect simulation, and EMI problem improvement, enabling complete model simulation design of multiple RF system platforms throughout their lifecycle. EMIT employs a unique multi-fidelity approach to predict RF co-location/co-existence interference, allowing rapid localization and 'root cause' analysis of EMI problems in complex RF environments.

Application areas: RF system design and integration; platform-level co-location interference; electronic warfare; vehicle; aviation; aerospace; communication; EMI/EMC

 

Electronic Design and Simulation Tools

 

Ansys HFSS: A three-dimensional structural high frequency electromagnetic field simulation tool

Ansys HFSS is the industry benchmark and gold tool for high frequency structural EMF simulation tools, truly solving EMFs of arbitrary three-dimensional structures with a wide range of adaptability; its applications stretch from DC through to optical wave bands. With a simple and easy-to-use graphical user interface, the software automatically generates meshes and conducts adaptive mesh refinement, supporting broadband adaptive mesh profiling. Highly accurate, reliable and stable EMF solving is realized with the high-performance EMF solver. Since it's fully oriented to engineering problems, you can quickly achieve highly accurate simulation results without having to acquire intensive knowledge of EMF and repeatedly try different mesh profiling. The software supports a variety of electromagnetic field solvers, including frequency domain finite element solver, time domain finite element solver, eigenmode solver, characteristic mode solver, integral equation method, physical optics method, multilayer planar structure moment method, domain decomposition method, finite large array antenna solver; it supports multi-algorithm hybrid calculations and is capable of solving all kinds of high-frequency and radiation problems in an all-around and reliable manner. It enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: High-frequency devices; antennas; cables; integrated circuit packaging; connectors; PCBs; antenna layout; electromagnetic compatibility

 

 

Ansys Maxwell: A two-dimensional/three-dimensional dynamic electromagnetic field simulation tool

Ansys Maxwell is extensively used for the design of a wide range of electromagnetic components, including motors, electromagnetic sensors, actuators, magnetic heads, transformers, inductors and more. The electromagnetic field simulation enables the calculation of electric and magnetic field distributions. The visualization of dynamic field distribution is used to analyze the performance of devices and to yield parameters such as force, torque and inductance that match the measurement results.

The automatic mesh profiling and adaptive mesh profiling allows the use of advanced finite element methods to yield highly accurate simulation results without having to repeatedly define the meshes themselves. This can greatly reduce the difficulty of using the software and improve engineering practicality, thus minimizing product development costs and shortening design cycles. It automatically generates ROM models, enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: Various motors (rotary motors, and linear motors); electromagnetic coils; transformers; magnetic recording; magnetization; demagnetization; actuators; electromagnetic sensors; frictionless bearings; other electromagnetic components

 

 

Ansys Q3D Extractor: A three-dimensional structural parasitic parameter extraction tool

Ansys Q3D Extractor performs electromagnetic field calculations, extracts parasitic parameters (resistance R, inductance L, capacitance C, and conductance G), and generates SPICE/IBIS equivalent circuit models based on the structure of electronic component. With the increasing speed and integration of electronics, the effects such as reflections, transmission delays, crosstalk and synchronous switching noise (SSN) in systems are increasingly significant. The electromagnetic parasitic effects of complex structures such as packages, connectors, and cables in systems must be accurately simulated to ensure the operational performance of system. Ansys Q3D Extractor uses the boundary element method to quickly solve for electromagnetic parasitic parameters based on structural form and material properties. Two-way coupled simulation with Ansys Structure/Fluid is possible.

Application areas: Integrated circuit packaging; connectors; sockets; PCBs; touch screens; fingerprint readers; contactless smart cards

 

Ansys SIwave: A full SI/PI and EMI/EMC simulation design tool for PBC and BGA packaging

Ansys SIwave offers full signal integrity and power integrity simulation design for PCBs, BAG packaging, etc. With modern electronic devices developing in the direction of low voltage and low power consumption, noise tolerances for printed circuit boards and packages have been narrowing; in memory circuits, for example, synchronous switching noise is often the main cause of system defects; therefore, the power supply system must be optimally designed to ensure system specifications and proper circuit operation.

With the latest optimization algorithms, Ansys SIwave efficiently performs holistic simulations of complex, large circuit boards. This comprises signal line parameter extraction, power/ground plane parameter extraction, DC voltage drop simulation, crosstalk simulation, far-field and near-field radiation simulations, electromagnetic sensitivity simulation, embedded capacitor, and inductor device model libraries. It enables bidirectional coupled simulation and co-simulation with Ansys structural/fluid software and circuit/system software.

Application areas: Printed circuit boards; BGA packaging

 

 

Ansys Savant: Antenna layout analysis software for electric large platforms

Savant is a high-frequency progressive electromagnetic analysis software. It uses the bouncing ray (SBR) progressive algorithm and a hybrid computational technique with the HFSS full wave solver to support CPU and GPU acceleration. This enables fast and accurate prediction of the performance of loaded antennas mounted on platforms of tens to thousands of wavelengths in size, yielding results such as mutual coupling effects between multiple antennas, spatial near/far field distribution, radiated and scattered fields.

Application areas: Antenna layout and integration; electronic warfare; communication links; co-location jamming; vehicle mounted radar; vehicle interconnection; EMI/EMC, etc.

 

Ansys Icepak: A thermal design simulation tool for electronics

Ansys Icepak is a professional thermal design simulation tool for electronics. It employs the fluid simulation tool Ansys Fluent as its solver and comprises a rich set of physical models. The unique automatic unstructured mesh generation technology helps electronics engineers to achieve easy, accurate and fast engineering of thermal design and simulation.

The software supports a wide range of CAD and EDA data and enables simulation models to be built, meshes to be generated, solved and post-processed and simulation results to be studied in an integrated environment. It can be used for a wide range of applications from the full range of thermal simulation and design of various semiconductor devices such as BGAs, QFPs, LEDs and IGBTs to circuit boards and enclosures.

The software exports thermal simulation results to the multidimensional multi-domain electromechanical system circuit and system simulation design tool Ansys Twin Builder, which simulates the operating characteristics of the system at different temperatures: It reads Joule heat from DC simulations from the board and package SI/PI/EMI simulation tool Ansys SIwave as a distributed heat source for full board and system thermal simulations.

 

Thermal Fluid Analysis of Graphic Board

 

Circuit and System Simulation Software

Ansys RF Option (Designer RF): An integrated simulation environment for high-frequency circuits/systems and electromagnetic fields

Ansys RF Option is an integrated simulation environment for high frequency circuits and systems. It supports the design of all types of wired and wireless communication systems and circuit simulations; provides powerful system simulation capabilities, a harmonic balance analog non-linear frequency domain circuit simulator, and a momentum multilayer planar structure electromagnetic field simulation tool; enables system simulation design, DC analysis, linear network analysis, cross-modulation and non-linear distortion simulation, circuit modulation envelope simulation, oscillator simulation, phase noise simulation, time-varying noise simulation, layout simulation and patch antenna design; supports a wide range of non-linear device models and LTCC, MMIC and RFIC process models; performs automatic bidirectional dynamic linking and on-demand solving with HFSS, a 3D EMF tool, for efficient and accurate design.

 

 

Ansys SI Option (Designer SI): An integrated simulation environment for high-speed circuits/systems and electromagnetic fields

Ansys SI Option seamlessly integrates the circuit/system time-frequency domain simulation techniques and EMF model extraction required for high-speed design into an automated design environment, taking full account of the impact of PCBs, cables and more. The unique "solving on demand" technique allows solvers to be selected depending on need. This environment supports SPICE models, IBIS models and IBIS-AMI models, S-parameter models, etc. It provides a variety of simulation techniques including frequency and time domain system simulators, linear circuit simulators, linear and non-linear transient circuit simulators, momentum method multi-layer planar structure electromagnetic field simulators, etc. for the simulation and analysis of high-speed circuits and EMI problems.

 

Ansys Twin Builder——System Simulator 

Ansys Twin Builder is an integrated system simulation tool that converts Ansys CAE 3D simulation models for EMF/structural/fluid/thermal analysis into 0D components and provides a high-accuracy and high-speed system simulation environment. In addition to using Ansys CFD, Modelica and VHDL-AMS, SPICE and MATLAB/Simulink coupling analysis as computational models, it's also possible to use the functional safety embedded software development tool Ansys SCADE as a controller model and perform system verification.

 

 

Ansys EMIT: System-level electromagnetic interference analysis software

EMIT is the simulation software for predicting electromagnetic interference (EMI) in complex radio frequency (RF) environments. EMIT offers a holistic framework for RF system performance data management, co-location and co-existence EMI effect simulation, and EMI problem improvement, enabling complete model simulation design of multiple RF system platforms throughout their lifecycle. EMIT employs a unique multi-fidelity approach to predict RF co-location/co-existence interference, allowing rapid localization and 'root cause' analysis of EMI problems in complex RF environments.

Application areas: RF system design and integration; platform-level co-location interference; electronic warfare; vehicle; aviation; aerospace; communication; EMI/EMC